Services We Provide
Services
 |
| |
 |
| |
 |
| |
 |
| |
 |
| |
 |
| |
 |
With China entering the WTO as well as evolving to become a
global manufacturing center, Chinese enterprises have been
accelerating their pace in the effort to gain footholds in the world
market. As one of the leading IC packaging and discrete device
manufacture provider in China, JCET is exploring the way to the
frontiers in the world market. JCET US, JCET’s first North
American sales and technical support office reinforces our
assertion for providing the highest quality value-added services at
the lowest cost.
Currently, JCET is promoting new patented packaging
technology, FBP , and is, as has always been, providing IC
packaging service with traditional technologies, such as: DIP,
SDIP, FDIP, SOP, SSOP, HSOP, QFN, PQFP, LQFP, TQFP,
SIP, HSIP, PLCC etc.
JCET US is a convenient portal for our North American clients
linking with our service resource facilities in China. Our sales and
technical staff are ready to serve new and existing clients timely
and professionally. If your interest is to improve performance and /
or to lower your manufacturing cost for a new or existing device
product, please contact us by clicking here.
JCET US provides local project management skills and technical
support to our clients in North America. With years of experience,
our JCET US team offers a high level of service performance to
ensure each and every project at JCET is a success.
Our team of service and technical representatives work closely
with each client from pre-production through to delivery of finished
product. From request for quotations (RFQ), to designing for
manufacturing (DFM) reviews, JCET US is dedicated to provide
superb value-added services to every client.
If you would like to have more information about our service,
please click here to contact us.
global manufacturing center, Chinese enterprises have been
accelerating their pace in the effort to gain footholds in the world
market. As one of the leading IC packaging and discrete device
manufacture provider in China, JCET is exploring the way to the
frontiers in the world market. JCET US, JCET’s first North
American sales and technical support office reinforces our
assertion for providing the highest quality value-added services at
the lowest cost.
Currently, JCET is promoting new patented packaging
technology, FBP , and is, as has always been, providing IC
packaging service with traditional technologies, such as: DIP,
SDIP, FDIP, SOP, SSOP, HSOP, QFN, PQFP, LQFP, TQFP,
SIP, HSIP, PLCC etc.
JCET US is a convenient portal for our North American clients
linking with our service resource facilities in China. Our sales and
technical staff are ready to serve new and existing clients timely
and professionally. If your interest is to improve performance and /
or to lower your manufacturing cost for a new or existing device
product, please contact us by clicking here.
JCET US provides local project management skills and technical
support to our clients in North America. With years of experience,
our JCET US team offers a high level of service performance to
ensure each and every project at JCET is a success.
Our team of service and technical representatives work closely
with each client from pre-production through to delivery of finished
product. From request for quotations (RFQ), to designing for
manufacturing (DFM) reviews, JCET US is dedicated to provide
superb value-added services to every client.
If you would like to have more information about our service,
please click here to contact us.
Copyright 2006 © JCET. All Rights Reserved
